A Cu–carbon hybrid interconnect was recently proposed as an alternate interconnect structure for future VLSI applications because of its superior electrical performance over its counterparts. This study focuses on the electro-thermal aspects of Cu–carbon hybrid interconnects to be adopted as a potential replacement of copper as the back-end-of-line (BEOL) interconnect material. Cu–carbon hybrid shows promise in terms of electro-thermal efficiency when compared to copper as well as other suggested hybrid materials. The maximum temperature attained by the Cu–carbon hybrid interconnect is less than copper by 16%, and its mean time to failure is improved by 96%. Uniform distribution of heat can be observed in the Cu–carbon hybrid BEOL in addition to low temperature rise as compared to the copper based BEOL. These analyses strengthen the claim of Cu–carbon hybrid interconnects to be a worthier possibility for electro-thermal efficient nanoscale systems.
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5 September 2022
Research Article|
September 08 2022
Electro-thermal modeling and reliability analysis of Cu–carbon hybrid interconnects for beyond-CMOS computing
B. Kumari
;
B. Kumari
(Conceptualization, Formal analysis, Investigation, Methodology, Visualization, Writing – original draft, Writing – review & editing)
1
Department of Electronics and Communication Engineering, Indian Institute of Technology (Indian School of Mines)
, Dhanbad 826004, India
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R. Sharma
;
R. Sharma
(Funding acquisition, Resources, Supervision, Writing – review & editing)
2
Department of Electrical Engineering, Indian Institute of Technology Ropar
, Rupnagar, Punjab, India
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M. Sahoo
M. Sahoo
a)
(Funding acquisition, Project administration, Resources, Supervision, Writing – review & editing)
1
Department of Electronics and Communication Engineering, Indian Institute of Technology (Indian School of Mines)
, Dhanbad 826004, India
a)Author to whom correspondence should be addressed: [email protected]
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a)Author to whom correspondence should be addressed: [email protected]
Note: This paper is part of the APL Special Collection on Dimensional Scaling of Material Functional Properties to meet Back-End-of-Line (BEOL) Challenges.
Appl. Phys. Lett. 121, 101901 (2022)
Article history
Received:
May 31 2022
Accepted:
August 20 2022
Citation
B. Kumari, R. Sharma, M. Sahoo; Electro-thermal modeling and reliability analysis of Cu–carbon hybrid interconnects for beyond-CMOS computing. Appl. Phys. Lett. 5 September 2022; 121 (10): 101901. https://doi.org/10.1063/5.0101329
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