This work reports an AlN/GaN/InGaN high electron mobility transistor (HEMT) with a steep subthreshold swing (SS) of sub-60 mV/dec utilizing a coupling-channel architecture. The fabricated transistors show a negligible hysteresis, a SS of 39 mV/dec, a large gate voltage swing of >4.2 V, and achieving an excellent quality factor Q = gm/SS of 6.3 μS-dec/μm-mV. The negative differential resistance effect was found in the subthreshold region in the gate current–voltage (IgVGS) curve. The hot carrier transfer mechanism that occurred in the turn-on/pinch-off progress of the CC-HEMT under the dual-directional sweep, proved by the VDS- and Lg-dependent bi-directional transfer I–V characteristics, can be responsible for these excellent device performances. This work is believed to encourage further study of the AlN/GaN platform to power the future group III-nitrides CMOS technology.

1.
U. K.
Mishra
,
L.
Shen
,
T. E.
Kazior
, and
Y.-F.
Wu
,
Proc. IEEE
96
,
287
305
(
2008
).
2.
M.
Sun
,
Y.
Zhang
,
X.
Gao
, and
T.
Palacios
,
IEEE Electron Device Lett.
38
,
509
512
(
2017
).
3.
Y.
Hao
,
L.
Yang
,
X. H.
Ma
,
J. G.
Ma
,
C. Y.
Pan
,
C.
Wang
, and
J. C.
Zhang
,
IEEE Electron Device Lett.
32
,
626
628
(
2011
).
4.
S. J.
Bader
,
H.
Lee
,
R.
Chaudhuri
,
S.
Huang
,
A.
Hickman
,
A.
Molnar
,
H. G.
Xing
,
D.
Jena
,
H. W.
Then
,
N.
Chowdhury
, and
T.
Palacios
,
IEEE Trans. Electron Devices
67
,
4010
4020
(
2020
).
5.
N.
Chowdhury
,
G.
Iannaccone
,
G.
Fiori
,
D. A.
Antoniadis
, and
T.
Palacios
,
IEEE Electron Device Lett.
38
,
859
862
(
2017
).
6.
S. J.
Bader
,
R.
Chaudhuri
,
A.
Hickman
,
K.
Nomoto
,
S.
Bharadwaj
,
H. W.
Then
,
H. G.
Xing
, and
D.
Jena
, in
IEEE International Electron Devices Meeting
(
IEEE
,
2019
), pp.
4.5.1
4.5.4
.
7.
K.
Nomoto
,
R.
Chaudhuri
,
S. J.
Bader
,
L.
Li
,
A.
Hickman
,
S.
Huang
,
H.
Lee
,
T.
Maeda
,
H. W.
Then
,
M.
Radosavljevic
,
P.
Fischer
,
A.
Molnar
,
J.
Hwang
,
H. G.
Xing
, and
D.
Jena
, in
IEEE International Electron Devices Meeting
(
IEEE
,
2020
), pp.
8.3.1
8.3.4
.
8.
K.
Shinohara
,
A.
Corrion
,
D.
Regan
,
I.
Milosavljevic
,
D.
Brown
,
S.
Burnham
,
P. J.
Willadsen
,
C.
Butler
,
A.
Schmitz
,
D.
Wheeler
,
A.
Fung
, and
M.
Micovic
, in
International Electron Devices Meeting
(
IEEE
,
2010
), pp.
30.1.1
30.1.4
.
9.
R.
Chaudhuri
,
S. J.
Bader
,
Z.
Chen
,
D. A.
Muller
,
H. G.
Xing
, and
D.
Jena
,
Science
365
,
1454
1457
(
2019
).
10.
Y.
Chu
,
S.
Lu
,
N.
Chowdhury
,
M.
Povolotskyi
,
G.
Klimeck
,
M.
Mohamed
, and
T.
Palacios
,
IEEE Electron Device Lett.
40
,
874
877
(
2019
).
11.
Q.
Dai
,
D. H.
Son
,
Y. J.
Yoon
,
J. G.
Kim
,
X.
Jin
,
I. M.
Kang
,
D. H.
Kim
,
Y.
Xu
,
S.
Cristoloveanu
, and
J. H.
Lee
,
IEEE Trans. Electron Devices
66
,
1699
1703
(
2019
).
12.
H. W.
Then
,
S.
Dasgupta
,
M.
Radosavljevic
,
L.
Chow
,
B.
Chu-Kung
,
G.
Dewey
,
S.
Gardner
,
X.
Gao
,
J.
Kavalieros
,
N.
Mukherjee
,
M.
Metz
,
M.
Oliver
,
R.
Pillarisetty
,
V.
Rao
,
S. H.
Sung
,
G.
Yang
, and
R.
Chau
, in
IEEE International Electron Devices Meeting
(
IEEE
,
2013
), pp.
28.3.1
28.3.4
.
13.
Q.
Zhou
,
S.
Huang
,
H. W.
Chen
,
C. H.
Zhou
,
Z. H.
Feng
,
S. J.
Cai
, and
K. J.
Chen
, in
International Electron Devices Meeting
(
IEEE
,
2011
), pp.
33.4.1
33.4.4
.
14.
P.
Cui
,
G.
Lin
,
J.
Zhang
, and
Y.
Zeng
,
IEEE Electron Device Lett.
41
,
1185
1188
(
2020
).
15.
A.
Hickman
,
R.
Chaudhuri
,
S. J.
Bader
,
K.
Nomoto
,
L.
Li
,
J.
Hwang
,
H. G.
Xing
, and
D.
Jena
,
Semicond. Sci. Technol.
36
,
044001
(
2021
).
16.
H.
Lu
,
B.
Hou
,
L.
Yang
,
X. R.
Niu
,
Z. Y.
Si
,
M.
Zhang
,
M.
Wu
,
M. H.
Mi
,
Q.
Zhu
,
K.
Cheng
,
X. H.
Ma
, and
Y.
Hao
,
IEEE Trans. Electron Devices
68
,
3308
3313
(
2021
).
17.
Y.
Zhang
,
R.
Guo
,
S.
Xu
,
J.
Zhang
,
S.
Zhao
,
H.
Wang
,
Q.
Hu
,
C.
Zhang
, and
Y.
Hao
,
Appl. Phys. Lett.
115
,
072105
(
2019
).
18.
S.
Salahuddin
and
S.
Datta
,
Nano Lett.
8
,
405
410
(
2008
).
19.
A.
Malmros
,
P.
Gamarra
,
M.
Poisson
,
H.
Hjelmgren
,
C.
Lacam
,
M.
Thorsell
,
M.
Tordjman
,
R.
Aubry
, and
N.
Rorsman
,
IEEE Electron Device Lett.
36
,
235
237
(
2015
).
20.
K. S.
Im
,
H. S.
Kang
,
J. H.
Lee
,
S. J.
Chang
,
S.
Cristoloveanu
,
M.
Bawedind
, and
J. H.
Lee
,
Solid-State Electron.
97
,
66
75
(
2014
).
21.
E.
Ture
,
P.
Brückner
,
R.
Quay
,
O.
Ambacher
,
M.
Alsharef
,
R.
Granzner
, and
F.
Schwierz
, in
11th European Microwave Integrated Circuits Conference
(
IEEE
,
2016
), pp.
61
64
.
22.
K.
Zhang
,
Y.
Kong
,
G.
Zhu
,
J.
Zhou
,
X.
Yu
,
C.
Kong
,
Z.
Li
, and
T.
Chen
,
IEEE Electron Device Lett.
38
,
615
618
(
2017
).
23.
G.
Doornbos
and
M.
Passlack
,
IEEE Electron Device Lett.
31
,
1110
1112
(
2010
).
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