Characterizing coefficient of thermal expansion (CTE) for thin films is often challenging as the experimental signal is asymptotically reduced with decreasing thickness. Here, we present a method to measure CTE of thin films by locally confining an active thermal volume using harmonic Joule heating. Importantly, we simultaneously probe the harmonic expansion at atomic-scale thickness resolution using atomic force microscopy. We use a differential method on lithographically patterned thin films to isolate the topographical and harmonic thermal expansion contributions of the thin films. Based on the measured thermal expansion, we use numerical simulations to extract the CTE considering the stress induced from neighboring layers. We demonstrate our method using poly(methyl methacrylate), and the measured CTE of 55.0 × 10−6 ± 6.4 × 10−6 K−1 shows agreement with previous works. This work paves an avenue for investigating thermo-mechanical characterization in numerous materials systems, including both organic and inorganic media.
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10 May 2021
Research Article|
May 11 2021
Thermal expansion characterization of thin films using harmonic Joule heating combined with atomic force microscopy
Settasit Chaikasetsin
;
Settasit Chaikasetsin
1
Department of Mechanical Engineering, Stanford University
, Stanford, California 94305, USA
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Takashi Kodama
;
Takashi Kodama
2
Department of Mechanical Engineering, The University of Tokyo
, Tokyo 113-8656, Japan
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Kiho Bae;
Kiho Bae
1
Department of Mechanical Engineering, Stanford University
, Stanford, California 94305, USA
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Jun Young Jung
;
Jun Young Jung
3
Center for Scientific Instrumentation, Korea Basic Science Institute
, Daejeon 34133, South Korea
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Jeeyoung Shin;
Jeeyoung Shin
4
Department of Mechanical Systems Engineering, Sookmyung Women's University
, Seoul 04310, South Korea
5
Institute of Advanced Material Systems, Sookmyung Women's University
, Seoul 04310, South Korea
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Byung Chul Lee
;
Byung Chul Lee
6
Center for BioMicrosystems, Korea Institute of Science and Technology
, Seoul 02792, South Korea
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Brian S. Y. Kim;
Brian S. Y. Kim
7
Department of Mechanical Engineering, Columbia University
, New York, New York 10027, USA
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Jungju Seo;
Jungju Seo
3
Center for Scientific Instrumentation, Korea Basic Science Institute
, Daejeon 34133, South Korea
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Uk Sim
;
Uk Sim
a)
8
Department of Material Science and Engineering, Chonnam National University
, Gwangju 61186, South Korea
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Fritz B. Prinz;
Fritz B. Prinz
1
Department of Mechanical Engineering, Stanford University
, Stanford, California 94305, USA
9
Department of Materials Science and Engineering, Stanford University
, Stanford, California 94305, USA
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Kenneth E. Goodson;
Kenneth E. Goodson
1
Department of Mechanical Engineering, Stanford University
, Stanford, California 94305, USA
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Woosung Park
Woosung Park
a)
4
Department of Mechanical Systems Engineering, Sookmyung Women's University
, Seoul 04310, South Korea
5
Institute of Advanced Material Systems, Sookmyung Women's University
, Seoul 04310, South Korea
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Appl. Phys. Lett. 118, 194101 (2021)
Article history
Received:
March 02 2021
Accepted:
April 26 2021
Citation
Settasit Chaikasetsin, Takashi Kodama, Kiho Bae, Jun Young Jung, Jeeyoung Shin, Byung Chul Lee, Brian S. Y. Kim, Jungju Seo, Uk Sim, Fritz B. Prinz, Kenneth E. Goodson, Woosung Park; Thermal expansion characterization of thin films using harmonic Joule heating combined with atomic force microscopy. Appl. Phys. Lett. 10 May 2021; 118 (19): 194101. https://doi.org/10.1063/5.0049160
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