In this letter, we design and demonstrate an improved metalorganic chemical vapor deposition (MOCVD) grown reverse Al-composition graded contact layer, whereby the Al-composition of AlxGa1−xN in the contact layer is graded from the higher Al-composition as in the channel to lower Al-composition, to achieve a low resistance contact to MOCVD grown ultrawide bandgap Al0.70Ga0.30N channel metal-semiconductor field-effect transistors. Increasing the thickness of the reverse graded layer was found to improve contact layer resistance significantly, leading to a contact resistivity of 3.3 × 10−5 Ω cm2. Devices with a gate length, LG, of 0.6 μm and a source-drain spacing, LSD, of 1.5 μm displayed a maximum current density, IDS,MAX, of 635 mA/mm with an applied gate voltage, VGS, of +2 V. Breakdown measurements on transistors with a gate to drain spacing, LGD, of 770 nm had breakdown voltage greater than 220 V, corresponding to a minimum breakdown field of 2.86 MV/cm—almost 3× higher than that exhibited by lateral GaN channel devices with similar dimensions. This work provides a framework for the design of low resistance contacts to MOCVD grown high Al-content AlxGa1−xN channel transistors.

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