HfOxNy thin films were deposited on polished and oxidized silicon wafers at different nitrogen-oxygen gas flow rates by DC magnetron reactive sputtering, and temperature sensors based on these HfOxNy thin films were fabricated using a microelectromechanical system micromachining process. The resistanceβtemperature dependencies of these sensors were studied in the temperature range of 4.2βKβ300βK, and the effect of the sputtering gas flow rate on the initial resistivity and sensitivity [temperature coefficient of resistance and absolute sensitivity (Sa)] was discussed. One of these sensors was subjected to 15 cycles between 300βK and 4.2βK for thermal cycle stability testing. The performances of these sensors were compared to the now available negative temperature coefficient thin film temperature sensors (ZrNx, CrNx, RuO2, and ZrOxNy), and they show very outstanding sensitivity and thermal cycle stability. Furthermore, the conduction mechanism of HfOxNy thin films in the cryogenic region was studied for the first time.
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24 September 2018
Research Article|
September 27 2018
NTC thin film temperature sensors for cryogenics region with high sensitivity and thermal stability Available to Purchase
Zude Lin;
Zude Lin
National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Collaborative Innovation Center of IFSA, Department of Micro/Nano-Electronics, Shanghai Jiao Tong University
, Shanghai 200240, China
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Guanghui Zhan;
Guanghui Zhan
National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Collaborative Innovation Center of IFSA, Department of Micro/Nano-Electronics, Shanghai Jiao Tong University
, Shanghai 200240, China
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Minmin You;
Minmin You
National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Collaborative Innovation Center of IFSA, Department of Micro/Nano-Electronics, Shanghai Jiao Tong University
, Shanghai 200240, China
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Bin Yang;
Bin Yang
National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Collaborative Innovation Center of IFSA, Department of Micro/Nano-Electronics, Shanghai Jiao Tong University
, Shanghai 200240, China
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Xiang Chen;
Xiang Chen
National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Collaborative Innovation Center of IFSA, Department of Micro/Nano-Electronics, Shanghai Jiao Tong University
, Shanghai 200240, China
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Xiaolin Wang;
Xiaolin Wang
National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Collaborative Innovation Center of IFSA, Department of Micro/Nano-Electronics, Shanghai Jiao Tong University
, Shanghai 200240, China
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Weiping Zhang
;
Weiping Zhang
National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Collaborative Innovation Center of IFSA, Department of Micro/Nano-Electronics, Shanghai Jiao Tong University
, Shanghai 200240, China
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Jingquan Liu
Jingquan Liu
a)
National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Collaborative Innovation Center of IFSA, Department of Micro/Nano-Electronics, Shanghai Jiao Tong University
, Shanghai 200240, China
a)Author to whom correspondence should be addressed: [email protected]
Search for other works by this author on:
Zude Lin
National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Collaborative Innovation Center of IFSA, Department of Micro/Nano-Electronics, Shanghai Jiao Tong University
, Shanghai 200240, China
Guanghui Zhan
National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Collaborative Innovation Center of IFSA, Department of Micro/Nano-Electronics, Shanghai Jiao Tong University
, Shanghai 200240, China
Minmin You
National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Collaborative Innovation Center of IFSA, Department of Micro/Nano-Electronics, Shanghai Jiao Tong University
, Shanghai 200240, China
Bin Yang
National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Collaborative Innovation Center of IFSA, Department of Micro/Nano-Electronics, Shanghai Jiao Tong University
, Shanghai 200240, China
Xiang Chen
National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Collaborative Innovation Center of IFSA, Department of Micro/Nano-Electronics, Shanghai Jiao Tong University
, Shanghai 200240, China
Xiaolin Wang
National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Collaborative Innovation Center of IFSA, Department of Micro/Nano-Electronics, Shanghai Jiao Tong University
, Shanghai 200240, China
Weiping Zhang
National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Collaborative Innovation Center of IFSA, Department of Micro/Nano-Electronics, Shanghai Jiao Tong University
, Shanghai 200240, China
Jingquan Liu
a)
National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Collaborative Innovation Center of IFSA, Department of Micro/Nano-Electronics, Shanghai Jiao Tong University
, Shanghai 200240, China
a)Author to whom correspondence should be addressed: [email protected]
Appl. Phys. Lett. 113, 133504 (2018)
Article history
Received:
June 27 2018
Accepted:
September 11 2018
Citation
Zude Lin, Guanghui Zhan, Minmin You, Bin Yang, Xiang Chen, Xiaolin Wang, Weiping Zhang, Jingquan Liu; NTC thin film temperature sensors for cryogenics region with high sensitivity and thermal stability. Appl. Phys. Lett. 24 September 2018; 113 (13): 133504. https://doi.org/10.1063/1.5046379
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