Surfaces with enhanced and tunable adhesion have a variety of applications, including microtransfer printing of semiconductor elements, material handling in manufacturing, and gripping surfaces on climbing robots. Traditionally, schemes to achieve tunable adhesion have relied on fabricating arrays of posts or fibers with complex geometries, such as angled posts terminated by wider caps. Here, we describe an alternative to post structures with complex geometries through the use of composite posts that consist of a stiff core and a compliant shell. Posts consisting of a stiff core and compliant shell have enhanced adhesion under normal loading, and the pull-off can be reduced via the application of shear. The adhesion mechanics of composite posts are demonstrated here through a combination of finite element simulations and experimental measurements on individual millimeter-scale posts.
Skip Nav Destination
CHORUS
Article navigation
18 May 2015
Research Article|
May 22 2015
Achieving enhanced and tunable adhesion via composite posts
H. K. Minsky;
H. K. Minsky
Department of Mechanical Engineering and Applied Mechanics,
University of Pennsylvania
, 220 South 33rd Street, Philadelphia, Pennsylvania 19104, USA
Search for other works by this author on:
K. T. Turner
K. T. Turner
a)
Department of Mechanical Engineering and Applied Mechanics,
University of Pennsylvania
, 220 South 33rd Street, Philadelphia, Pennsylvania 19104, USA
Search for other works by this author on:
a)
Electronic mail: kturner@seas.upenn.edu
Appl. Phys. Lett. 106, 201604 (2015)
Article history
Received:
March 15 2015
Accepted:
May 09 2015
Citation
H. K. Minsky, K. T. Turner; Achieving enhanced and tunable adhesion via composite posts. Appl. Phys. Lett. 18 May 2015; 106 (20): 201604. https://doi.org/10.1063/1.4921423
Download citation file:
Pay-Per-View Access
$40.00
Sign In
You could not be signed in. Please check your credentials and make sure you have an active account and try again.
Citing articles via
Roadmap on photonic metasurfaces
Sebastian A. Schulz, Rupert. F. Oulton, et al.
Era of entropy: Synthesis, structure, properties, and applications of high-entropy materials
Christina M. Rost, Alessandro R. Mazza, et al.
Piezoelectric phononic integrated circuits
Krishna C. Balram
Related Content
Interface mechanics of adhesiveless microtransfer printing processes
J. Appl. Phys. (April 2014)
Investigating the pattern transfer fidelity of Norland Optical Adhesive 81 for nanogrooves by microtransfer molding
J. Vac. Sci. Technol. B (December 2021)
Embossing of polymers using a thermosetting polymer mold made by soft lithography
J. Vac. Sci. Technol. B (June 2003)
Enhanced adhesion with pedestal-shaped elastomeric stamps for transfer printing
Appl. Phys. Lett. (April 2012)