Creating uniform coatings of a solution-cast material is of central importance to a broad range of applications. Here, a robust and generic theoretical framework for calculating surface coverage by a solid film of material de-wetting a substrate is presented. Using experimental data from semiconductor thin films as an example, we calculate surface coverage for a wide range of annealing temperatures and film thicknesses. The model generally predicts that for each value of the annealing temperature there is a range of film thicknesses leading to poor surface coverage. The model accurately reproduces solution-cast thin film coverage for organometal halide perovskites, key modern photovoltaic materials, and identifies processing windows for both high and low levels of surface coverage.
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3 March 2014
Research Article|
March 03 2014
Controlling coverage of solution cast materials with unfavourable surface interactions
V. M. Burlakov;
V. M. Burlakov
1
Mathematical Institute, University of Oxford
, Woodstock Rd, Oxford OX2 6GG, United Kingdom
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G. E. Eperon;
G. E. Eperon
2
Clarendon Laboratory, Department of Physics, University of Oxford
, Parks Road, Oxford OX1 3PU, United Kingdom
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H. J. Snaith;
H. J. Snaith
2
Clarendon Laboratory, Department of Physics, University of Oxford
, Parks Road, Oxford OX1 3PU, United Kingdom
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S. J. Chapman;
S. J. Chapman
1
Mathematical Institute, University of Oxford
, Woodstock Rd, Oxford OX2 6GG, United Kingdom
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A. Goriely
A. Goriely
1
Mathematical Institute, University of Oxford
, Woodstock Rd, Oxford OX2 6GG, United Kingdom
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Appl. Phys. Lett. 104, 091602 (2014)
Article history
Received:
November 08 2013
Accepted:
February 18 2014
Citation
V. M. Burlakov, G. E. Eperon, H. J. Snaith, S. J. Chapman, A. Goriely; Controlling coverage of solution cast materials with unfavourable surface interactions. Appl. Phys. Lett. 3 March 2014; 104 (9): 091602. https://doi.org/10.1063/1.4867263
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