Despite progress in the performance of Bi2Sr2CaCu2Ox (Bi2212)/Ag multifilamentary round wires, understanding the impact of microstructural defects on multiple length scales on electrical transport remains a significant challenge. Many recent studies have focused on porosity, but porosity is not the only factor in determining Jc. The primary impurity in partial-melt processed multifilamentary Bi2212 wires is Bi2Sr2CuOx (Bi2201), which forms as mesoscopic grains and nanoscopic intergrowths. Previously, we showed the destructive effect of Bi2201 grains on transport. Here, we relate scanning transmission electron microscopy results to the Bi2212 coherence length, anisotropic magnetization behavior, and magnetic-field dependent transport to study c-axis transport and the effects of Bi2201 intergrowths on magnetic flux pinning. We show that wide Bi2201 intergrowths are barrier to c-axis transport within Bi2212 grains, whereas narrow (half- and full-cell) Bi2201 intergrowths are not detrimental to c-axis transport and are likely magnetic flux pinning centers. These results have significant impact on the understanding of Bi2212/Bi2201 systems and provide important physical insight towards future improvements in devices based upon wires, film, and junctions.
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14 April 2014
Research Article|
April 17 2014
On the roles of Bi2Sr2CuOx intergrowths in Bi2Sr2CaCu2Ox/Ag round wires: c-axis transport and magnetic flux pinning
G. Naderi;
G. Naderi
a)
Department of Materials Science and Engineering,
North Carolina State University
, Raleigh, North Carolina 27695-7907, USA
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J. Schwartz
J. Schwartz
Department of Materials Science and Engineering,
North Carolina State University
, Raleigh, North Carolina 27695-7907, USA
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a)
Author to whom correspondence should be addressed. Electronic mail: [email protected]
Appl. Phys. Lett. 104, 152602 (2014)
Article history
Received:
March 02 2014
Accepted:
April 08 2014
Citation
G. Naderi, J. Schwartz; On the roles of Bi2Sr2CuOx intergrowths in Bi2Sr2CaCu2Ox/Ag round wires: c-axis transport and magnetic flux pinning. Appl. Phys. Lett. 14 April 2014; 104 (15): 152602. https://doi.org/10.1063/1.4871805
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