This work presents polymer based composite materials used in slurries form to print low cost and scalable micro-scale Thermoelectric Generator (TEG) devices. Bi-epoxy composite is chosen as n-type material and mechanical alloy p-type Bi0.5Sb1.5Te3 with 8 wt. % extra Te-epoxy composite is used as p-type material. Maximum power factor of 0.00008 W/m-K2 is achieved for Bi-epoxy and Bi0.5Sb1.5Te3 with 8 wt. % extra Te-epoxy composite dispenser printed thick films. A 10 couple dispenser printed circular TEG prototype produced 130 μW power at ΔT of 70 K resulting in a device areal power density of 1230 μW/cm2.
REFERENCES
1.
H. J.
Goldsmid
and R. W.
Douglas
, Br. J. Appl. Phys.
5
, 386
(1954
).2.
K. C.
See
, J. P.
Feser
, C. E.
Chen
, A.
Majumdar
, J. J.
Urban
, and R. A.
Segalman
, Nano Lett.
10
, 4664
(2010
).3.
J.
Weber
, K.
Potje-Kamloth
, F.
Haase
, P.
Detemple
, and F.
Volklein
, Sens. Actuators, A
132
, 325
(2006
).4.
O.
Bubnova
, Z. U.
Khan
, A.
Malti
, S.
Braun
, M.
Fahlman
, M.
Berggren
, and X.
Crispin
, Nature Mater.
10
, 429
(2011
).5.
D.
Madan
, A.
Chen
, P. K.
Wright
, and J. W.
Evans
, J. Appl. Phys.
109
, 034904
(2011
).6.
D.
Madan
, Z.
Wang
, A.
Chen
, R. C.
Juang
, J.
Keist
, P. K.
Wright
, and J. W.
Evans
, ACS Appl. Mater. Interfaces
4
, 6117
(2012
).7.
A.
Chen
, D.
Madan
, P. K.
Wright
, and J. W.
Evans
, J. Micromech. Microeng.
21
, 104006
(2011
).8.
C. C.
Ho
, J. W.
Evans
, and P. K.
Wright
, J. Micromech. Microeng.
20
, 104009
(2010
).9.
D.
Madan
, Z.
Wang
, A.
Chen
, P. K.
Wright
, and J. W.
Evans
, ACS Appl. Mater. Interfaces
5
(22
), 11872
(2013
).10.
D.
Madan
, Z.
Wang
, A.
Chen
, P. K.
Wright
, and J. W.
Evans
, J. Electron. Mater.
41
, 1481
(2012
).11.
Z.
Wang
, A.
Chen
, R.
Winslow
, D.
Madan
, R. C.
Juang
, P. K.
Wright
, and J. W.
Evans
, J. Micromech. Microeng.
22
, 094001
(2012
).12.
B.
Poudel
, Q.
Hao
, Y.
Ma
, Y.
Lan
, A.
Minnich
, B.
Yu
, X.
Yan
, D.
Wang
, A.
Muto
, D.
Vashaee
, X.
Chen
, J.
Liu
, M. S.
Dresselhaus
, G.
Chen
, and Z.
Ren
, Science
320
, 634
(2008
).© 2014 AIP Publishing LLC.
2014
AIP Publishing LLC
You do not currently have access to this content.