The effects of AlN interlayer growth conditions on InAlN/AlN/GaN heterostructures are investigated, with interlayers imaged as they would appear prior to InAlN barrier layer deposition using surface atomic force microscopy scans undertaken immediately after growth. Surface morphologies and subsequent heterostructure conductivity suggested minimum on-resistance can be achieved by balancing the underlying GaN channel decomposition and interfacial roughening when deciding AlN interlayer growth parameters on a sapphire substrate of a given miscut.

1.
D. S.
Lee
,
X.
Gao
,
S.
Guo
,
D.
Kopp
,
P.
Fay
, and
T.
Palacios
,
IEEE Electron Device Lett.
32
(
11
),
1525
(
2011
).
2.
Y. F.
Wu
,
M.
Moore
,
A.
Saxler
,
T.
Wisleder
, and
P.
Parikh
, in
Proceedings of the 64th Device Research Conference, Pennsylvania State College, Pennsylvania, USA, 26–28 June 2006
(
IEEE
,
New York
,
2006
), pp.
151
152
.
3.
O.
Ambacher
,
J.
Smart
,
J. R.
Shealy
,
N. G.
Weimann
,
K.
Chu
,
M.
Murphy
,
W. J.
Schaff
,
L. F.
Eastman
,
R.
Dimitrov
,
L.
Wittmer
,
M.
Stutzmann
,
W.
Rieger
, and
J.
Hilsenbeck
,
J. Appl. Phys.
85
(
6
),
3222
(
1999
).
4.
V.
Narayanan
,
K.
Lorenz
,
W.
Kim
, and
S.
Mahajan
,
Philos. Mag. A
82
(
5
),
885
(
2002
).
5.
M.
Gonschorek
,
J. F.
Carlin
,
E.
Feltin
,
M. A.
Py
, and
N.
Grandjean
,
Appl. Phys. Lett.
89
(
6
),
062106
(
2006
).
6.
H.
Kim-Chauveau
,
P.
de Mierry
,
J.-M.
Chauveau
, and
J.-Y.
Duboz
,
J. Cryst. Growth
316
(
1
),
30
36
(
2011
).
7.
L.
Kirste
,
T.
Lim
,
R.
Aidam
,
S.
Mueller
,
P.
Waltereit
, and
O.
Ambacher
,
Phys. Status Solidi A
207
(
6
),
1338
(
2010
).
8.
A.
Teke
,
S.
Gökden
,
R.
Tülek
,
J. H.
Leach
,
Q.
Fan
,
J.
Xie
,
Ü.
Özgür
,
H.
Morkoç
,
S. B.
Lisesivdin
, and
E.
Özbay
,
New J. Phys.
11
,
063031
(
2009
).
9.
M.
Moran
,
C. S.
Ghedia
,
D. V. S.
Rao
,
J. S.
Barnard
,
Y.
Zhang
,
M. J.
Kappers
, and
C. J.
Humphreys
,
J. Appl. Phys.
106
,
073513
(
2009
).
You do not currently have access to this content.