Stretchable electronics typically integrate hard, functional materials on soft substrates. Here we report on engineered elastomeric substrates designed to host stretchable circuitry. Regions of a stiff material, patterned using photolithography, are embedded within a soft elastomer leaving a smooth surface. We present the associated design rules to produce stretchable circuits based on experimental as well as modeling data. We demonstrate our approach with thin-film electronic materials. The “customized” elastomeric substrates may also be used as a generic elastic substrate for stretchable circuits prepared with alternative technologies, such as transfer-printing of inorganic, thinned devices.
REFERENCES
1.
2.
S.
Wagner
, S. P.
Lacour
, J.
Jones
, P.-H.
Hsu
, J. C.
Sturm
, T.
Li
, and Z.
Suo
, “13th International winterschool on new developments in solid state physics, low-dimensional systems
,” Physica E
25
, 326
–334
(2004
).3.
T.
Someya
, T.
Sekitani
, S.
Iba
, Y.
Kato
, H.
Kawaguchi
, and T.
Sakurai
, Proc. Natl. Acad. Sci. U.S.A.
101
(27
), 9966
–9970
(2004
).4.
H. C.
Ko
, M. P.
Stoykovich
, J.
Song
, V.
Malyarchuk
, W. M.
Choi
, C.-J.
Yu
, J. B.
Geddes
III, J. X.
Wang
, Y.
Huang
, and J. A.
Rogers
, Nature
454
, 748
–753
(2008
).5.
I.
Graz
, D.
Cotton
, A.
Robinson
, and S. P.
Lacour
, Appl. Phys. Lett.
98
, 124101
(2011
).6.
T.
Someya
, Y.
Kato
, T.
Sekitani
, S.
Iba
, Y.
Noguchi
, Y.
Murase
, H.
Kawaguchi
, and T.
Sakurai
, Proc. Natl. Acad. Sci. U.S.A.
102
(35
), 12321
–12325
(2005
).7.
T.
Sekitani
, H.
Nakajima
, H.
Maeda
, T.
Fukushima
, T.
Aida
, K.
Hata
, and T.
Someya
, Nature Mater.
8
, 494
–499
(2009
).8.
M.
Gonzalez
, F.
Axisa
, F.
Bossuyt
, Y.-Y.
Hsu
, B.
Vandevelde
, and J.
Vanfleteren
, Circuit World
35
(1
), 22
–29
(2009
).9.
J. A.
Rogers
, T.
Someya
, and Y.
Huang
, Science
327
, 1603
–1607
(2010
).10.
D.-H.
Kim
, Z.
Liu
, Y.-S.
Kim
, J.
Wu
, J.
Song
, H.-S.
Kim
, Y.
Huang
, K.-C.
Hwang
, Y.
Zhang
, and J. A.
Rogers
, Small
5
(24
), 2841
–2847
(2009
).11.
R.-H.
Kim
, D.-H.
Kim
, J.
Xiao
, B. H.
Kim
, S.-I.
Park
, B.
Panilaitis
, R.
Ghaffari
, J.
Yao
, M.
Li
, Z.
Liu
, V.
Malyarchuk
, D. G.
Kim
, A.-P.
Le
, R. G.
Nuzzo
, D. L.
Kaplan
, F. G.
Omenetto
, Y.
Huang
, Z.
Kang
, and J. A.
Rogers
, Nature Mater.
9
, 929
–937
(2010
).12.
S. P.
Lacour
, J. E.
Jones
, S.
Wagner
, T.
Li
, and Z.
Suo
, Proc. IEEE
93
(8
), 1459
–1467
(2005
).13.
I.
Graz
, D.
Cotton
, and S. P.
Lacour
, Appl. Phys. Lett.
94
, 071902
(2009
).14.
S. P.
Lacour
, D.
Chan
, S.
Wagner
, T.
Li
, and Z.
Suo
, Appl. Phys. Lett.
88
, 204103
(2006
).15.
Z.
Suo
, J.
Vlassak
, and S.
Wagner
, China Particuol.
3
, 321
(2005
).16.
G.
Rochat
, Y.
Leterrier
, P.
Fayet
, and J.-A. E.
Månson
, Thin Solid Films
484
, 94
(2005
).© 2013 American Institute of Physics.
2013
American Institute of Physics
You do not currently have access to this content.
