Lattice-matched Ge1−x−ySixSny (x ≤ 0.2, y ≤ 0.05) alloys were deposited defect-free on Ge(001) substrates via low-temperature (330–290 °C) reactions of Ge4H10, Si4H10 and SnD4 hydrides, and used to fabricate pin photodetectors. The growth is carried out under gas-source molecular beam epitaxy conditions in a specially designed single-wafer reactor. Optical responsivity measurements reveal absorption edges between 0.88 eV and 0.98 eV, which are used to determine the compositional dependence of the direct band gap. A study of the I-V characteristics of the diodes shows that the dark current is very weakly correlated with the number of Si-Sn bonds in the alloy.
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The temperature values are approximate and correspond to readings of the heater thermocouple positioned inside the quartz enclosure, 3–5 mm removed from the backside of the wafer. Therefore, the true temperatures of the wafers are slightly lower.