The correlation between threshold voltage (VT) and channel boron concentration in silicon-based 65 nm node negative-type metal-oxide-semiconductor field-effect transistors was studied by atom probe tomography (APT). VT values were determined for one million transistors in a single chip, and transistors having a ±4σ deviation from the median VT were analyzed using APT. VT and the channel boron concentration were positively correlated. This is consistent with the relationship between the average boron concentration of wafers implanted with different channel doses and the median VT of the million transistors. APT is suitable for the study of dopant-distribution-based device failure mechanisms.

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