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ELECTROMIGRATION, STRESS AND RELIABILITY IN 3D STRUCTURES
TCAD modeling of stress impact on performance and reliability in 3D IC structures
AIP Conf. Proc. 1601, 128–137 (2014)
https://doi.org/10.1063/1.4881346
Design for reliability of BEoL and 3-D TSV structures – A joint effort of FEA and innovative experimental techniques
AIP Conf. Proc. 1601, 138–147 (2014)
https://doi.org/10.1063/1.4881347
Physics-based simulation of EM and SM in TSV-based 3D IC structures
AIP Conf. Proc. 1601, 114–127 (2014)
https://doi.org/10.1063/1.4881345
Modeling of microstructural effects on electromigration failure
AIP Conf. Proc. 1601, 99–113 (2014)
https://doi.org/10.1063/1.4881344
Electromigration void nucleation and growth analysis using large-scale early failure statistics
AIP Conf. Proc. 1601, 89–98 (2014)
https://doi.org/10.1063/1.4881343
OVERVIEW ON STRESSES AND RELIABILITY IN 3D STRUCTURES
Stress management for 3D through-silicon-via stacking technologies - The next frontier -
AIP Conf. Proc. 1601, 3–17 (2014)
https://doi.org/10.1063/1.4881338
Microstructure, impurity and metal cap effects on Cu electromigration
C.-K. Hu; L. G. Gignac; J. Ohm; C. M. Breslin; E. Huang; G. Bonilla; E. Liniger; R. Rosenberg; S. Choi; A. H. Simon
AIP Conf. Proc. 1601, 67–78 (2014)
https://doi.org/10.1063/1.4881341
Advanced concepts for TDDB reliability in conjunction with 3D stress
AIP Conf. Proc. 1601, 79–88 (2014)
https://doi.org/10.1063/1.4881342
MULTI-SCALE MATERIALS PARAMETERS, SIMULATION AND CHARACTERIZATION
Thermomechanical characterization and modeling for TSV structures
AIP Conf. Proc. 1601, 148–157 (2014)
https://doi.org/10.1063/1.4881348
Assessment of fracture and elastoplastic properties of thin and very thin films
M. Trueba; D. Gonzalez; I. Ocaña; M. R. Elizalde; J. M. Martinez-Esnaola; M. T. Hernandez; M. Haverty; G. Xu; D. Pantuso
AIP Conf. Proc. 1601, 158–167 (2014)
https://doi.org/10.1063/1.4881349
Effects of fluoride residue on thermal stability in Cu/porous low-k interconnects
AIP Conf. Proc. 1601, 180–185 (2014)
https://doi.org/10.1063/1.4881351
3D imaging of semiconductor components by discrete laminography
AIP Conf. Proc. 1601, 168–179 (2014)
https://doi.org/10.1063/1.4881350
The implementation of reflective assessment using Gibbs’ reflective cycle in assessing students’ writing skill
Lala Nurlatifah, Pupung Purnawarman, et al.
Classification data mining with Laplacian Smoothing on Naïve Bayes method
Ananda P. Noto, Dewi R. S. Saputro
Effect of coupling agent type on the self-cleaning and anti-reflective behaviour of advance nanocoating for PV panels application
Taha Tareq Mohammed, Hadia Kadhim Judran, et al.