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Molecular Dynamics Calculation of Thermal Conductivity of Graphene Nanoribbons
AIP Conf. Proc. 1173, 135–138 (2009)
https://doi.org/10.1063/1.3251208
Scaling Effects on Ferro‐Electrics: Application in Nanoelectronics and Characterization
AIP Conf. Proc. 1173, 129–134 (2009)
https://doi.org/10.1063/1.3251206
X‐ray Photoelectron Spectromicroscopy of Doped Silicon Patterns
AIP Conf. Proc. 1173, 99–103 (2009)
https://doi.org/10.1063/1.3251269
Electrical Measurements By Scanning Spreading Resistance Microscopy: Application To Carbon Nanofibers And Si Nanowires
N. Chevalier; D. Mariolle; L. Fourdrinier; C. Celle; C. Mouchet; S. Poncet; J. P. Simonato; H. Le Poche; E. Rouviere; F. Bertin; A. Chabli
AIP Conf. Proc. 1173, 285–289 (2009)
https://doi.org/10.1063/1.3251235
Wave Front Sensor for Highly Accurate Characterization of Flatness on Wafer Surfaces
AIP Conf. Proc. 1173, 188–192 (2009)
https://doi.org/10.1063/1.3251218
Characterization of Organic Contamination in Semiconductor Manufacturing Processes
A. Nutsch; B. Beckhoff; G. Bedana; G. Borionetti; D. Codegoni; S. Grasso; G. Guerinoni; A. Leibold; M. Müller; M. Otto; L. Pfitzner; M.‐L. Polignano; D. De Simone; L. Frey
AIP Conf. Proc. 1173, 23–28 (2009)
https://doi.org/10.1063/1.3251227
Nanoscale Characterization Of Ultra‐Thin Dielectrics Using Scanning Capacitance Microscopy
AIP Conf. Proc. 1173, 193–197 (2009)
https://doi.org/10.1063/1.3251219
Advanced Gate and Stack Dielectric Characterization with FastGate® Technology
AIP Conf. Proc. 1173, 89–93 (2009)
https://doi.org/10.1063/1.3251267
On The Use Of Synchrotron Radiation For The Characterization Of “” Gate Stacks
C. Gaumer; E. Martinez; S. Lhostis; F. Fillot; P. Gergaud; B. Detlefs; J. Roy; Y. Mi; J.‐P. Barnes; J. Zegenhagen; A. Chabli
AIP Conf. Proc. 1173, 40–44 (2009)
https://doi.org/10.1063/1.3251257
Contact Resistance Studies of Metal on HOPG and Graphene Stacks
AIP Conf. Proc. 1173, 324–327 (2009)
https://doi.org/10.1063/1.3251243
Spectroscopic Ellipsometry of Porous Low‐κ Dielectric Thin Films
AIP Conf. Proc. 1173, 168–172 (2009)
https://doi.org/10.1063/1.3251215
Boron Nanowires for Flexible Electronics and Field Emission
AIP Conf. Proc. 1173, 317–323 (2009)
https://doi.org/10.1063/1.3251242
Effects of Experimental Parameters on the Work Function Measurement: A Kelvin Force Microscopy Study
AIP Conf. Proc. 1173, 224–228 (2009)
https://doi.org/10.1063/1.3251225
Temperature‐Programmed Gas‐Sensing With Microhotplates: an Opportunity to Enhance Microelectronic Gas Sensor Metrology
AIP Conf. Proc. 1173, 207–211 (2009)
https://doi.org/10.1063/1.3251222
Evaluation of experimental techniques for In‐line Ion Implantation Characterization
AIP Conf. Proc. 1173, 84–88 (2009)
https://doi.org/10.1063/1.3251266
Interference Microscopy For Semiconductor Back End Patterning Metrology
Xavier Colonna de Lega; Martin Fay; Ryan Kruse; David Grigg; Michael Darwin; Matthew Knowles; John Barnak; Maruko Wu
AIP Conf. Proc. 1173, 359–363 (2009)
https://doi.org/10.1063/1.3251251
Simulation Study Of Transmission Electron Microscopy Imaging Of Graphene Stacking
AIP Conf. Proc. 1173, 271–274 (2009)
https://doi.org/10.1063/1.3251232
Application Of The SPV‐based Surface Lifetime Technique To In‐Line Monitoring Of Surface Cu Contamination
John D’Amico; Alexandre Savtchouk; Matthew Wilson; Chul Hong Kim; Hyung Won Yoo; Chang Hwan Lee; Tae Kyoung Kim; Sang Hoon Son
AIP Conf. Proc. 1173, 75–79 (2009)
https://doi.org/10.1063/1.3251264
Advanced Capacitance Metrology for Nanoelectronic Device Characterization
Curt A. Richter; Joseph J. Kopanski; Chong Jiang; Yicheng Wang; M. Yaqub Afridi; Xiaoxiao Zhu; D. E. Ioannou; Qiliang Li
AIP Conf. Proc. 1173, 328–332 (2009)
https://doi.org/10.1063/1.3251244
Ultra‐thin AlOx and LaOx Metrology—WD‐XRF Technique Development
AIP Conf. Proc. 1173, 34–39 (2009)
https://doi.org/10.1063/1.3251249
Spectroscopic Polarimetry of Light scattered by Surface Roughness and Textured Films in Nanotechnologies
AIP Conf. Proc. 1173, 379–384 (2009)
https://doi.org/10.1063/1.3251254
NIST High Resolution X‐Ray Diffraction Standard Reference Material: SRM 2000
AIP Conf. Proc. 1173, 50–54 (2009)
https://doi.org/10.1063/1.3251259
Integrated ODP Metrology Matching To Reference Metrology For Lithography Process Control
AIP Conf. Proc. 1173, 349–353 (2009)
https://doi.org/10.1063/1.3251248
GIXRF In The Soft X‐Ray Range Used For The Characterization Of Ultra Shallow Junctions
AIP Conf. Proc. 1173, 29–33 (2009)
https://doi.org/10.1063/1.3251239
Application Of Statistical Dynamical X‐ray Diffraction Theory To Defective Semiconductor Heterostructures
AIP Conf. Proc. 1173, 385–389 (2009)
https://doi.org/10.1063/1.3251255
Understanding the phase images from off‐axis electron holography
AIP Conf. Proc. 1173, 266–270 (2009)
https://doi.org/10.1063/1.3251231
Compact X‐ray Tool For Critical‐Dimension Metrology
Boris Yokhin; Alexander Krokhmal; Alexander Dikopoltsev; David Berman; Isaac Mazor; Byoung‐Ho Lee; Dong‐Chul Ihm; Kwang Hoon Kim
AIP Conf. Proc. 1173, 364–368 (2009)
https://doi.org/10.1063/1.3251252
Modeling artifacts in the analysis of test semiconductor structures in atom probe tomography
AIP Conf. Proc. 1173, 175–180 (2009)
https://doi.org/10.1063/1.3251216
X‐ray Scattering Methods for Porosity Metrology of Low‐k Thin Films
AIP Conf. Proc. 1173, 163–167 (2009)
https://doi.org/10.1063/1.3251214
A Study Of Gate‐All‐Around Transistors By Electron Tomography
AIP Conf. Proc. 1173, 290–293 (2009)
https://doi.org/10.1063/1.3251236
Thickness Measurement of Thin‐metal Films by Optical Metrology
AIP Conf. Proc. 1173, 114–121 (2009)
https://doi.org/10.1063/1.3251204
Application of Micro‐thermal Analysis for Metal, Oxide, and Non‐oxide Thin Film Materials
AIP Conf. Proc. 1173, 217–223 (2009)
https://doi.org/10.1063/1.3251224
Post‐Deposition Annealing Analysis for Thin Films Using GIXRR/GIXRD
AIP Conf. Proc. 1173, 122–126 (2009)
https://doi.org/10.1063/1.3251205
Precession electron diffraction and its utility for structural fingerprinting in the transmission electron microscope
AIP Conf. Proc. 1173, 299–303 (2009)
https://doi.org/10.1063/1.3251238
High‐Resolution Rutherford Backscattering Analysis of Nanoscale Thin Films
AIP Conf. Proc. 1173, 80–83 (2009)
https://doi.org/10.1063/1.3251265
Polarized Optical Scattering Measurements of Metallic Nanoparticles on a Thin Film Silicon Wafer
AIP Conf. Proc. 1173, 203–206 (2009)
https://doi.org/10.1063/1.3251221
Aberration‐corrected Electron Microscopy Imaging for Nanoelectronics Applications
AIP Conf. Proc. 1173, 231–240 (2009)
https://doi.org/10.1063/1.3251226
Multi‐technique characterization of arsenic ultra shallow junctions in silicon within the ANNA consortium
D. Giubertoni; G. Pepponi; B. Beckhoff; P. Hoenicke; S. Gennaro; F. Meirer; D. Ingerle; G. Steinhauser; M. Fried; P. Petrik; A. Parisini; M. A. Reading; C. Streli; J. A. van den Berg; M. Bersani
AIP Conf. Proc. 1173, 45–49 (2009)
https://doi.org/10.1063/1.3251258
Characterization of and Hafnium Silicate Films on
AIP Conf. Proc. 1173, 55–61 (2009)
https://doi.org/10.1063/1.3251260
Spectroscopic Ellipsometry Characterization of High‐k films on
Ming Di; Eric Bersch; Steven Consiglio; Tianhao Zhang; Parul Tyagi; Robert D. Clark; Gert J. Leusink; Arun Srivatsa; Alain C. Diebold
AIP Conf. Proc. 1173, 104–108 (2009)
https://doi.org/10.1063/1.3251202
Automated crystal phase and orientation mapping of nanocrystals in a transmission electron microscope
AIP Conf. Proc. 1173, 304–308 (2009)
https://doi.org/10.1063/1.3251240
Corrected Electron Optics‐Improved Resolution and New Analysis Capabilities
AIP Conf. Proc. 1173, 241–248 (2009)
https://doi.org/10.1063/1.3251228
Understanding Imaging and Metrology with the Helium Ion Microscope
AIP Conf. Proc. 1173, 249–260 (2009)
https://doi.org/10.1063/1.3251229
Towards synchrotron‐based nanocharacterization
Pierre Bleuet; Lucile Arnaud; Xavier Biquard; Peter Cloetens; Lise Doyen; Patrice Gergaud; Patrick Lamontagne; Maylis Lavayssière; Jean‐Sébastien Micha; Olivier Renault; François Rieutord; Jean Susini; Olivier Ulrich
AIP Conf. Proc. 1173, 181–187 (2009)
https://doi.org/10.1063/1.3251217
Towards Routine Backside SIMS Sample Preparation for Efficient Support of Advanced IC Process Development
AIP Conf. Proc. 1173, 94–98 (2009)
https://doi.org/10.1063/1.3251268
Enhanced TEM Sample Preparation Using In‐situ Low Energy Argon Ion Milling
AIP Conf. Proc. 1173, 275–279 (2009)
https://doi.org/10.1063/1.3251233
Detection of Metal Contamination on Silicon Wafer Backside and Edge by New TXRF Methods
AIP Conf. Proc. 1173, 67–71 (2009)
https://doi.org/10.1063/1.3251262
EBSD Analysis of Narrow Damascene Copper Lines
AIP Conf. Proc. 1173, 154–158 (2009)
https://doi.org/10.1063/1.3251212
Enhanced Spatial Resolution Scanning Kelvin Force Microscopy Using Conductive Carbon Nanotube Tips
AIP Conf. Proc. 1173, 212–216 (2009)
https://doi.org/10.1063/1.3251223
Non‐Traditional Spectroscopy for Analysis of Semiconductor and Photovoltaic Thin Film Materials
AIP Conf. Proc. 1173, 62–66 (2009)
https://doi.org/10.1063/1.3251261
Simulations of Scatterometry Down to 22 nm Structure Sizes and Beyond with Special Emphasis on LER
AIP Conf. Proc. 1173, 371–378 (2009)
https://doi.org/10.1063/1.3251253
Quantifying and enforcing two‐dimensional symmetries in scanning probe microscopy images
AIP Conf. Proc. 1173, 294–298 (2009)
https://doi.org/10.1063/1.3251237
Correction of Hysteresis in SPM Images by a Moving Window Correlation Method
AIP Conf. Proc. 1173, 280–284 (2009)
https://doi.org/10.1063/1.3251234
Porous SiOCH Post Plasma Damage Characterization Using Ellipsometric Porosimetry
AIP Conf. Proc. 1173, 149–153 (2009)
https://doi.org/10.1063/1.3251211
Photoreflectance Spectroscopic Characterization of Si with and Dielectric Layers
Tianhao Zhang; Ming Di; Eric J. Bersch; Houssam Chouaib; Alex Salnik; Lena Nicolaides; Chris Bevis; Steven Consiglio; Robert D. Clark; Alain C. Diebold
AIP Conf. Proc. 1173, 109–113 (2009)
https://doi.org/10.1063/1.3251203
The implementation of reflective assessment using Gibbs’ reflective cycle in assessing students’ writing skill
Lala Nurlatifah, Pupung Purnawarman, et al.
Classification data mining with Laplacian Smoothing on Naïve Bayes method
Ananda P. Noto, Dewi R. S. Saputro
Effect of coupling agent type on the self-cleaning and anti-reflective behaviour of advance nanocoating for PV panels application
Taha Tareq Mohammed, Hadia Kadhim Judran, et al.