The use of wafer inspection systems in managing semiconductor manufacturing yields is described. These systems now detect defects of size as small as 40 nm. Some high-speed systems have achieved 200-mm diameter wafer throughputs of 150 wafers per hour. The particular technologies involved are presented. Extensions of these technologies to meet the requirements of manufacturing integrated circuits with smaller structures on larger wafers are discussed.
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© 1998 American Institute of Physics.
1998
American Institute of Physics
