This article gives a summary of the 8th Metallization and Interconnection workshop and attempts to place each contribution in the appropriate context. The field of metallization and interconnection continues to progress at a very fast pace. Several printing techniques can now achieve linewidths below 20 µm. Screen printing is more than ever the dominating metallization technology in the industry, with finger widths of 45 µm in routine mass production and values below 20 µm in the lab. Plating technology is also being improved, particularly through the development of lower cost patterning techniques. Interconnection technology is changing fast, with introduction in mass production of multiwire and shingled cells technologies. New models and characterization techniques are being introduced to study and understand in detail these new interconnection technologies.
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18 September 2019
PROCEEDINGS OF THE 8TH WORKSHOP ON METALLIZATION AND INTERCONNECTION FOR CRYSTALLINE SILICON SOLAR CELLS
13–14 May 2019
Konstanz, Germany
Research Article|
September 18 2019
Summary of the 8th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells
Guy Beaucarne;
Guy Beaucarne
a)
1
Dow Silicones Belgium sprl, Parc Industriel, Zone C, Rue Jules Bordet
, 7180 Seneffe, Belgium
a)Corresponding author: [email protected]
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Gunnar Schubert;
Gunnar Schubert
2
University of Applied Science Konstanz
, Alfred-Wachtel Str. 8, 78462 Konstanz, Germany
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Loic Tous;
Loic Tous
3
imec
, kapeldreef 75, 3001 Leuven, Belgium
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Jaap Hoornstra
Jaap Hoornstra
4
Retired, Sint Maartensbrug
, The Netherlands
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a)Corresponding author: [email protected]
AIP Conf. Proc. 2156, 020001 (2019)
Citation
Guy Beaucarne, Gunnar Schubert, Loic Tous, Jaap Hoornstra; Summary of the 8th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells. AIP Conf. Proc. 18 September 2019; 2156 (1): 020001. https://doi.org/10.1063/1.5125866
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