In recent years, various modern technologies such as internet of things (IoT), Automation, and Industry 4.0, lead IC chips and related components to higher performance and more strict specification. To fit this trend, EMC or some chemical cured material is widely used as the insulation and package material in plastic IC encapsulation industry. However, during IC encapsulation process, shrinkage and warpage will be one of the main problems for quality control. More specific, how to precisely estimate the causes of volume change during the processing and then manage them is still very challenge. In this paper, we have proposed some new designs to extend previous literature’s concept using a single plunger type dilatometer to measure the volume change interacted with pressure and chemical conversion. Results showed that in the new specimen chamber design with smaller diameter and longer height the precision tolerance can beimproved from 1μm to 0.01μm. The output volume change history curve became more smoothly and robotically. Furthermore, through various testing for general thermoplastic and EMC materials based on our new heating system, the real volume change behavior with or without chemical reaction is in good agreement with that of literatures. Moreover, the obtained measured data has integrated into Moldex3D to perform some real IC complicated design encapsulation process testing, results present that when the system was covered both thermal and chemical shrinkage, the warpage trend can be precisely predicted; however, if it is only considered the thermal shrinkage, the warpage prediction will be opposite to the real one. It displayed how the chemical shrinkage estimate is so important in IC Encapsulation industry.
Investigation on the P-V-T-C property characterization and its importance on IC encapsulation material application
Chen-Chieh Wang, Chao-Tsai Huang, Chih-Chung Hsu, Rong-Yeu Chang, Ryan Huang, Michael F. Huang, Sheng-Jye Hwang; Investigation on the P-V-T-C property characterization and its importance on IC encapsulation material application. AIP Conf. Proc. 5 February 2019; 2065 (1): 020006. https://doi.org/10.1063/1.5088256
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