Charging mechanism during ion implantation without charge compensation

The charge accumulated on an electrode electrically floated during implantation is calculated using a simple model. The model includes the ion beam current, the secondary electron emission, the neutralizing electron current and the leak current through resistance between the electrode and the bulk of wafer. Expressing the leak current with a parameter of relaxation time, it is found that amount of the accumulated charge at the completion of implantation reached at a constant irrespective of the beam current in the condition that the relaxation time is long enough. The experimental result showed that the measured potential of the floated electrode depends on a beam potential as well as the beam current. This result implies that the neutralizing electrons are more effectively transported to the isolated electrode in the high beam current condition compared with in the low beam current condition. We discuss possibility that such charging phenomena may occur in the implantation for BiCMOS or SOI device fabrication.