Sarnoff Corporation has developed thermophotovoltaic (TPV) modules using either Sarnoff grown and processed InGaAsSb/GaSb TPV cells or cells fabricated by our co‐workers. The TPV module fabrication includes substrate design, fabrication and module assembly. The substrate comprises an AlN base plate and Al2O3 septa. The septa separate the cells and support metal layers to electrically connect the bottom of a cell to the top of the adjacent septum. A welded gold ribbon connects the septum to the topside of the adjacent cell. The detailed structure of the substrate, as well as the module assembly process, is discussed. TPV modules of 1 cm × 1 cm area with two 1 cm × 0.5 cm cells and 2 cm × 2 cm area with eight cells are fabricated routinely. Alternative approaches to the Al2O3/AlN substrate and ribbon connection have been explored for low‐cost, large‐scale production. Silicon based substrates show promising results. KOH wet etching of silicon produces septa with straight walls having perfect 90‐degree angles at the bottom without fillets. Plated gold forming an “air bridge” to connect the cell busbar and septum has the potential to replace the welded ribbon. Packaging p‐on‐n and n‐on‐p cells alternatively can drastically reduce the complexity of the module structure by facilitating all connections on a planar surface without septa. Sarnoff module technology, when combined with Sarnoff TPV‐cell technology and spectral‐control technologies from other organizations, has led to TPV power‐conversion efficiencies exceeding 17 % [1].
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25 January 2003
THERMOPHOTOVOLTAIC GENERATION OF ELECTRICITY: Fifth Conference on Thermophotovoltaic Generation of Electricity
16-19 September 2002
Rome (Italy)
Research Article|
January 25 2003
High‐Efficiency Multi‐Cell TPV Module Fabrication and Performance Available to Purchase
Y. Z. Yu;
Y. Z. Yu
*Sarnoff Corporation, CN5300, Princeton, New Jersey 08543‐5300
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R. U. Martinelli;
R. U. Martinelli
*Sarnoff Corporation, CN5300, Princeton, New Jersey 08543‐5300
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G. C. Taylor;
G. C. Taylor
*Sarnoff Corporation, CN5300, Princeton, New Jersey 08543‐5300
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Z. Shellenbarger;
Z. Shellenbarger
*Sarnoff Corporation, CN5300, Princeton, New Jersey 08543‐5300
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R. K. Smeltzer;
R. K. Smeltzer
*Sarnoff Corporation, CN5300, Princeton, New Jersey 08543‐5300
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K. Palit;
K. Palit
*Sarnoff Corporation, CN5300, Princeton, New Jersey 08543‐5300
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S. R. Burger;
S. R. Burger
†Lockheed Martin, Inc., Schenectady, New York 12301‐1072
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R. P. Cardines;
R. P. Cardines
†Lockheed Martin, Inc., Schenectady, New York 12301‐1072
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R. Danielson;
R. Danielson
†Lockheed Martin, Inc., Schenectady, New York 12301‐1072
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C. A. Wang;
C. A. Wang
††Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, Massachusetts 02173‐9108
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M. K. Conners
M. K. Conners
††Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, Massachusetts 02173‐9108
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Y. Z. Yu
st
R. U. Martinelli
st
G. C. Taylor
st
Z. Shellenbarger
st
R. K. Smeltzer
st
J. Li
K. Palit
st
S. R. Burger
gger
R. P. Cardines
gger
R. Danielson
gger
C. A. Wang
ggerdagger
M. K. Conners
ggerdagger
*Sarnoff Corporation, CN5300, Princeton, New Jersey 08543‐5300
†Lockheed Martin, Inc., Schenectady, New York 12301‐1072
††Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, Massachusetts 02173‐9108
AIP Conf. Proc. 653, 335–343 (2003)
Citation
Y. Z. Yu, R. U. Martinelli, G. C. Taylor, Z. Shellenbarger, R. K. Smeltzer, J. Li, K. Palit, S. R. Burger, R. P. Cardines, R. Danielson, C. A. Wang, M. K. Conners; High‐Efficiency Multi‐Cell TPV Module Fabrication and Performance. AIP Conf. Proc. 25 January 2003; 653 (1): 335–343. https://doi.org/10.1063/1.1539388
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