A prototype system for rapid assessment of the quality of adhesive bonds used in vehicle manufacture has been developed. The system comprises a high-frequency, dry-coupled ultrasonic wheel probe, operating at a central frequency of 10 MHz, and novel instrumentation featuring rapid digital signal processing. In parallel to this, a low frequency (≈200 kHz) wheel probe device is under development. This device uses the joint’s resonances as an alternative method of assessment of the quality of the bond.

Topics
Ultrasonics, General procedures and instrumentation, Digital signal processing, Educational assessment
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© 2001 American Institute of Physics.
2001
American Institute of Physics
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