Electromigration in a Blech pattern as well as in a modified Blech pattern (i.e. a Blech pattern with a no current carrying reservoir) has been studied by means of resistance measurements using multiple voltage probes. When the current density J is higher than the critical value Jc, the present method turned out to be very effective to measure the edge drift velocity. Experiments on the modified Blech pattern show two types of voids: one is formed at low current densities at the end of the reservoir (type A) and the other is formed at the intersection of the current stressed area and the reservoir at rather high current densities (type B). The measurements indicate that both type A and B voids are already formed at a very early stage in the experiment. Although the exact mechanism is not clear yet, the appearance of type B voids is related to strong inhomogeneous Joule heating. When the current density is close to Jc the resistance of most Al interconnect segments reaches saturation in a relatively short time. However, the resistance of segments at the pattern edge does not saturate within the time of the experiments. The experiments strongly suggest that plastic processes that saturate on a rather short time scale take place in the inner segments.
Skip Nav Destination
Article navigation
3 November 1999
The fifth international workshop on stress induced phenomena in metallization
23-25 June 1999
Stuttgart (Germany)
Research Article|
November 03 1999
Multiprobe resistance monitoring of Blech pattern during electromigration testing
Shoso Shingubara;
Shoso Shingubara
1Department of Electrical Engineering, Hiroshima University Kagamiyama 1-4-1, Higashi-hiroshima, 739-8527, Japan
Search for other works by this author on:
Tamotsu Osaka;
Tamotsu Osaka
1Department of Electrical Engineering, Hiroshima University Kagamiyama 1-4-1, Higashi-hiroshima, 739-8527, Japan
Search for other works by this author on:
Hiroyuki Sakaue;
Hiroyuki Sakaue
1Department of Electrical Engineering, Hiroshima University Kagamiyama 1-4-1, Higashi-hiroshima, 739-8527, Japan
Search for other works by this author on:
Takayuki Takahagi;
Takayuki Takahagi
1Department of Electrical Engineering, Hiroshima University Kagamiyama 1-4-1, Higashi-hiroshima, 739-8527, Japan
Search for other works by this author on:
Ad H. Verbruggen
Ad H. Verbruggen
2DIMES, Delft University of Technology Lorentzweg 1, 2628 CJ Delft, The Netherlands
Search for other works by this author on:
AIP Conf. Proc. 491, 138–149 (1999)
Citation
Shoso Shingubara, Tamotsu Osaka, Hiroyuki Sakaue, Takayuki Takahagi, Ad H. Verbruggen; Multiprobe resistance monitoring of Blech pattern during electromigration testing. AIP Conf. Proc. 3 November 1999; 491 (1): 138–149. https://doi.org/10.1063/1.59901
Download citation file:
Pay-Per-View Access
$40.00
Sign In
You could not be signed in. Please check your credentials and make sure you have an active account and try again.
Citing articles via
Inkjet- and flextrail-printing of silicon polymer-based inks for local passivating contacts
Zohreh Kiaee, Andreas Lösel, et al.
Effect of coupling agent type on the self-cleaning and anti-reflective behaviour of advance nanocoating for PV panels application
Taha Tareq Mohammed, Hadia Kadhim Judran, et al.
Design of a 100 MW solar power plant on wetland in Bangladesh
Apu Kowsar, Sumon Chandra Debnath, et al.
Related Content
Blech effect in Pb-free flip chip solder joint
Appl. Phys. Lett. (January 2009)
Redistribution of Pb-rich phase during electromigration in eutectic SnPb solder stripes
J. Appl. Phys. (March 2006)
Electromigration-induced voiding mechanisms in metallizations
AIP Conference Proceedings (June 1996)
Stress and alloying effects in electromigration
AIP Conference Proceedings (June 1996)
Large‐Scale Statistics for Cu Electromigration
AIP Conference Proceedings (June 2009)