We have conducted a series of accelerated exposure test (AET) studies for various crystalline-Si (c-Si) and amorphous-Si (a-Si) cell samples that were encapsulated with different superstrates, pottants, and substrates. Nonuniform browning patterns of ethylene vinyl acetate (EVA) pottants were observed for glass/EVA/glass-encapsulated c-Si cell samples under solar simulator exposures at elevated temperatures. The polymer/polymer-configured laminates with Tedlar or Tefzel did not discolor because of photobleaching reactions, but yellowed with polyester or nylon top films. Delamination was observed for the polyester/EVE layers on a-Si minimodules and for a polyolefin-based thermoplastic pottant at high temperatures. For all tested c-Si cell samples, irregular changes in the current-voltage parameters were observed that could not be accounted for simply by the transmittance changes of the superstrate/pottant layers. Silicone-type adhesives used under UV-transmitting polymer top films were observed to cause greater cell current/efficiency loss than EVA or polyethylene pottants.
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5 March 1999
National center for photovoltaics (NCPV) 15th program review meeting
9-11 Sept 1998
Denver, Colorado (USA)
Research Article|
March 05 1999
Accelerated exposure tests of encapsulated Si solar cells and encapsulation materials
F. J. Pern;
F. J. Pern
Engineering and Reliability Division, National Center for Photovoltaics, National Renewable Energy Laboratory, 1617 Cole Blvd., Golden, Colorado 80401
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S. H. Glick
S. H. Glick
Engineering and Reliability Division, National Center for Photovoltaics, National Renewable Energy Laboratory, 1617 Cole Blvd., Golden, Colorado 80401
Search for other works by this author on:
F. J. Pern
S. H. Glick
Engineering and Reliability Division, National Center for Photovoltaics, National Renewable Energy Laboratory, 1617 Cole Blvd., Golden, Colorado 80401
AIP Conf. Proc. 462, 559–564 (1999)
Citation
F. J. Pern, S. H. Glick; Accelerated exposure tests of encapsulated Si solar cells and encapsulation materials. AIP Conf. Proc. 5 March 1999; 462 (1): 559–564. https://doi.org/10.1063/1.58000
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