Contact resistance (Rc) is an extremely significant metric to determine the caliber of ohmic contact which regulates the current flow. This study examines the contact interface of several materials, specifically Copper metal – Copper metal [Cum − Cum], Copper metal – Graphene layer [Cum − Grl], Graphene layer – Graphene layer [Grl − Grl], and Graphene layer coated over Copper metal – Graphene layer [Cum/Grl – Grl]. The COMSOL Multiphysics simulation software is utilized to investigate the electrical and structural analysis of the contact interface. The contact resistance is greatly reduced at the interface of Cum/Grl, increasing current density. Low-resistance ohmic contacts are highly advantageous in many electronic devices such as high electron mobility transistors, MOSFETs, and electromechanical relays. They are beneficial in various applications, from low-power digital logic to high-power scenarios.
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6 June 2024
7TH INTERNATIONAL CONFERENCE ON NANOSCIENCE AND NANOTECHNOLOGY
27–29 March 2023
Chennai, India
Research Article|
June 06 2024
Graphene-Infused copper contacts: Achieving ultra-low resistance ohmic interfaces
Thanigaivelraja Mohandoss;
Thanigaivelraja Mohandoss
b)
1
Department of Electrical and Electronics Engineering, SRM Institute of Science and Technology
, Kattankulathur, Chennai, Tamil Nadu – 603 203, India
Search for other works by this author on:
Femi Robert
Femi Robert
a)
1
Department of Electrical and Electronics Engineering, SRM Institute of Science and Technology
, Kattankulathur, Chennai, Tamil Nadu – 603 203, India
a)Corresponding author: [email protected]
Search for other works by this author on:
Thanigaivelraja Mohandoss
1,b)
Femi Robert
1,a)
1
Department of Electrical and Electronics Engineering, SRM Institute of Science and Technology
, Kattankulathur, Chennai, Tamil Nadu – 603 203, India
a)Corresponding author: [email protected]
AIP Conf. Proc. 3170, 040011 (2024)
Citation
Thanigaivelraja Mohandoss, Femi Robert; Graphene-Infused copper contacts: Achieving ultra-low resistance ohmic interfaces. AIP Conf. Proc. 6 June 2024; 3170 (1): 040011. https://doi.org/10.1063/5.0215814
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