Many devices, including digital cameras, washing machines, smart cars, computers, etc., will have a PCB as an integral component. Today’s PCB demands the highest density of components and increased tolerance on these components. Surface mount technology (SMT) is making it possible to add many miniaturized components to PCBs. Component size is decreasing, and the component number is increasing; inspecting these components is becoming even more challenging. As many products are becoming smart, there is a huge demand for PCBs. Huge demands for PCBs also demand quicker inspection techniques. This shows the increased demand for online and inspection techniques. Many types of defects are encountered in the manufacturing of PCBs, such as missing components, cracks, etc. Many of the existing inspection techniques are not suitable for online PCB evaluation. In this scenario, the method presented in this article becomes very important. The present method uses image processing and deep learning-based technique for image identification and classification. Also, the method helps in the real-time assessment of PCBs.

1.
M.
Moganti
,
F.
Ercal
,
C.H.
Dagli
, and
S.
Tsunekawa
, “
Automatic PCB inspection algorithms: A survey
,”
Comput. Vision Image Understanding
, Vol.
63
, No.
2
, pp.
287
313
(
1996
).
2.
M.
Sasai
et al.,
2000
, “Printed Circuit Board Inspection for Flexible Manufacture,”
5th World Conference on Nondestructive Testing Proceedings
,
Italy
(2000).
3.
S.
Mashohor
,
J.R.
Evans
,
T.
Arslan
, “
Genetic Algorithms Based to Printed Circuit Board (PCB) Inspection System
,”
IEEE International Symposium Consumer Electronics
(
2004
).
4.
Greenberg
, et al.,
Method for printed circuit board inspection
”,
United States Patent
6
,
990
,
227
(
2006
).
5.
S.H.
Oguz
,
L.
Onural
, “
An automated system for design-rule-based visual inspection of printed circuit boards
,”
1991
.
Proceedings. IEEE International Conference on Robotics and Automation
, pp.
2696
2701
(1991).
6.
W.
Capson
, “
A tiered-color illumination approach for machine inspection of solder joints
,”
IEEE Trans. Pattern Anal. Machine Intell.
, vol.
10
, pp.
387
393
, May (
1988
).
7.
Y.
Nakagawa
, “
Automatic visual inspection of solder joints on printed circuit boards
,”
Proc. SPIE
, vol.
336
,
121
127
, (
1982
).
8.
M.B.
Kiran
,
Additive manufacturing of titanium alloys-a review
,
Proceedings of the International Conference on Industrial Engineering and Operations Management
, pp.
2553
2564
(
2021
).
9.
M.B.
Kiran
,
Lean transformation in electricity transmission tower manufacturing company-a case study
,
Proceedings of the International Conference on Industrial Engineering and Operations Management
,
2021
, pp.
2961
2974
.
10.
M.B.
Kiran
,
Productivity assessment studies in solenoid valve manufacturing company – a case study
,
Proceedings of the International Conference on Industrial Engineering and Operations Management
,
2021
, pp.
3037
3046
.
11.
M.B.
Kiran
,
A novel online surface roughness measuring method
,
Proceedings of the International Conference on Industrial Engineering and Operations Management
,
2021
, pp.
2907
2916
This content is only available via PDF.
You do not currently have access to this content.