A two-dimensional monolayer of silicon atoms, called silicene, is similar to graphene, yet arranged in a hexagonal buckled lattice. By replacing all the silicon-28 atoms in silicene with other stable silicon isotopes, i.e. silicon-29 and silicon-30, it is possible to engineer the band structure of silicene and thus making it a potential material for an isotopic homojunction, which means that a “heterostructure” can be formed by replacing atoms in the unit cell with their isotope counterparts. In this study, we investigate the effect of different silicon isotopes on the band structure of silicene by first-principles calculations. We find that there might be a change in the lattice constant of silicene due to the isotopic substitution and thus the electronic energy dispersion can be modified in the order of meV. In the case of the phonon dispersion, the isotope mass will give a dominant contribution to shifting the phonon frequency.
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24 May 2023
PROCEEDINGS OF 2ND INTERNATIONAL CONFERENCE ON CONDENSED MATTERS AND ADVANCED MATERIALS (IC2MAM)
27 October 2020
Malang, Indonesia
Research Article|
May 24 2023
Silicene band structure engineering for potential isotopic homojunction applications
M. A. Rahman;
M. A. Rahman
b)
1
Department of Physics, Faculty of Mathematics and Natural Sciences, Universitas Indonesia
, Depok 16424, Indonesia
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A. B. Cahaya;
A. B. Cahaya
a)
1
Department of Physics, Faculty of Mathematics and Natural Sciences, Universitas Indonesia
, Depok 16424, Indonesia
a)Corresponding author: [email protected]
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A. R. T. Nugraha;
A. R. T. Nugraha
c)
2
Research Center for Physics, Indonesian Institute of Sciences (LIPI)
, Tangerang Selatan 15314, Indonesia
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M. A. Majidi
M. A. Majidi
d)
1
Department of Physics, Faculty of Mathematics and Natural Sciences, Universitas Indonesia
, Depok 16424, Indonesia
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a)Corresponding author: [email protected]
AIP Conf. Proc. 2748, 020064 (2023)
Citation
M. A. Rahman, A. B. Cahaya, A. R. T. Nugraha, M. A. Majidi; Silicene band structure engineering for potential isotopic homojunction applications. AIP Conf. Proc. 24 May 2023; 2748 (1): 020064. https://doi.org/10.1063/5.0138824
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