We report on the results of optimizing a single flat heat pipe into an arrangement of heat pipes. A comparison is drawn at the same temperatures and occupied volumes and for a specific maximum temperature of radio-electronic devices. The end result of our studies is that the limiting heat transfer capacity has been found for a single heat pipe and two- and three-level heat pipe assemblies with various heat transfer media. Versatility of the mathematical model enhanced by the optimization method has been proved.

Topics
Electronic devices, Heat transfer, Thermal instruments, Mathematical modeling
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