Copper is one of the most widely used material for thermal conductivities, fuel cells, sensors, processor chips of high-speed computer, and applications which require miniaturization, sophisticated design, and improved thermal management/electrical conductivity. In the powder metallurgy, manufacturing of more difficult to machine parts are produced by this method. In this research article, water atomized copper powder is selected and blended with the aqua- based binder, which is placed in a die and compacted with minimal pressure. The samples were sintered in both air and nitrogen with varying three sets of 860, 980, 10000C temperatures. The fabricated components were characterized by hardness, density, porosity by various tests.
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