The aim of the research was to study the kinetic regularities of the chemical copper plating process, allowing to determine the influence of each component on the speed of the metal deposition process. The basis for the study was chosen trilonate solution of chemical copper plating of the following composition, mol·l−1: Trilon B – 0.10; copper sulfuric acid – 0.036; sodium hydroxide – 0.20; formaldehyde – 0.13. In addition, additives were present in the solution: surfactant–2K – 0.05 g·l-1; potassium hexaferricyanide – 0.06 g·l−1; 2,2’–dipyridyl – 0.06 g·l−1. It is shown that the greatest influence on the speed of the process has a concentration of alkali. The particular order of reaction for hydroxyl ions is 0.685. The partial orders of reaction for formaldehyde and Trilon B are 0.129 and 0.042, respectively. The value of the activation energy of the copper plating process from trionate solutions equal to 58040 J·mol−1 was determined. The critical rate of the chemical copper plating process for obtaining plastic coatings, equal to 3.5 to 4 microns/h, was determined.

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