In the paper, simulation of the polishing prosess of copper crystal was carried out using the method of molecular dynamics. We investigated the effect of the size of the indenter on the acoustic emission in the sample. The velocity of the center of mass of the sensor, changing of the system energy and the formation of defects during loading was analyzed. According to the obtained results, an increase in the radius of curvature of the indenter leads to changes in the main mechanism of plastic deformation of the material, and hence changes in the signal AE.
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