For the photoselective activation of the surface of inorganic dielectric materials and fiberglass with an epoxy-rubber adhesive layer, compositions based on copper(II) compounds containing sodium salts of anthraquinon sulfonic acids and secondary sorbitol and ethanol as an optical sensitizer can be used. The metallization process of dielectric materials, in particular, copper plating is autocatalytic. The catalyst is the surface of an already formed copper coating. The concentration of catalytically active centers on the surface of the dielectric should be high enough to produce the high-quality solid copper coating. Organic solvents (dimethylformamide and dimethylsulfoxide) are entered a photosensitive composition for an increase in the amount of copper(II) at the surfaces of the dielectric. They are used at a stage of swelling of an epoxyrubber adhesive layer of fiber glasses by preparation of a dielectric surface. In this case, the photosensitive composition is fixed on the surface of the dielectric not only due to microroughness but also is capable to get deep into the bulked-up adhesive layer. The amount of copper(II) deposited on the surface of the dielectric in the composition of the photocomposition was determined using atomic absorption (AAMA) and X-ray diffraction fluorescence analysis methods (RSFA). It is established that the amount of copper(II) on the surface of the dielectric increases by 2‒3 times at increase in time of drawing photocomposition from 0.5 to 5 of minutes. Thus, the photosensitive layer is fixed on the dielectric surface not only due to microroughness but also due to the adsorption of photocomposition by an adhesive layer. It is shown that the amount of copper(II) on a surface is more than when drawing photocomposition with dimethylformamide when drawing on the dielectric of the photocomposition containing 10% volume a dimethylsulfoxide. This suggests that the swelling of the adhesive layer in DMSO is more effective. It is established that the introduction of organic solvents into the photoactivator composition increases the concentration of copper(II) on the surface and in the adhesive layer. For the best fixing of photocomposition on the surface of the dielectric material, the photoactivator was entered into the structure of the photoactivator. Introduction to the structure of the photoactivator of surfactants increases the speed of photorestoration of copper(II) in a dry layer of the photoactivator. Surfactants increase the amount of copper(II) by the surfaces of the dielectric and promote the best distribution of the photoactivator. Nonionic surfactant of the OP-10 brand as a part of the photoactivator considerably increases adhesion of a metal coating to the dielectric.

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