Thermal issue is the biggest challenge in Light-emitting diodes (LEDs) industries. The demand of high Lumens LED has led to the development of the LED array. Different arrangement of the LED chip on metal core printed circuit board (MCPCB) provides different thermal performance. Hence, the LED chip arrangement on MCPCB is one of the vital factors for thermal management. This study utilized the open source software, Salome and Elmer for thermal simulation. The thermal effect of rectangle grid, circular grid and hexagonal grid of LED chip arrangement were demonstrated in this study. The thermal effect of the LED chip arrangement corresponding to the MCPCB and heat sink shape was discussed.

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