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2014
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Paul S. Ho, Chao-Kun Hu, Mark Nakamoto, Shinichi Ogawa, Larry Smith, Valeriy Sukharev, Ehrenfried Zschech; Preface: Stress-Induced Phenomena and Reliability in 3D Microelectronics. AIP Conf. Proc. 19 June 2014; 1601 (1): 1–2. https://doi.org/10.1063/1.4881337
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