Thermo-mechanical reliability evaluation for microelectronic packaging using C-mode scanning acoustic microscopy Available to Purchase

C-mode Scanning Acoustic Microscopy (C-SAM) is an excellent tool for nondestructive failure analysis and reliability evaluation of microelectronic packaging. During operation and thermal cycling, defects such as cracks, delamination and voids can emerge and grow under thermo-mechanical stresses caused by materials with different coefficients of thermal expansion (CTE) and mechanical properties. According to the MIL-STD-883H Microcircuits Test Method Standard, the thermal cycling test on a set of microelectronic packaging was conducted and the defects propagation of microelectronic packaging was studied experimentally using C-mode Scanning Acoustic Microscopy.