Conventional superplastic forming (SPF) has been modified to increase the productivity and reduce some of the drawbacks, such as high forming temperature and high percentage thinning, to suit the automotive industries. One of the modifications was to combine between the conventional SPF and the use of a mechanical preformed blank to form the non‐superplastic grade aluminum alloy (AA5083‐O). The requirement of high temperature usually results in microstructural defects during forming process. In this paper, finite element modeling was adopted to investigate the superplastic‐like forming process using the non‐isothermal heating system. In the simulation, two phases (mechanical pre‐forming and gas blow for ming) of the process were conducted under different temperatures, where the material was mechanically drawn into the die cavity at 200° C in the first phase, and it formed with gas pressure applied at a global temperature increasing from 400° C to 500° C. Because of the non‐isothermal heating of material, it was found that it had enough ductility to flow more easily in the specific zones (die corners and radius). Additionally, FEM results showed that a better formed part can be obtained by the increasing temperature forming, compared to the stable temperature phase.
Skip Nav Destination
,
,
,
,
,
,
Article navigation
17 January 2011
INTERNATIONAL CONFERENCE ON ADVANCES IN MATERIALS AND PROCESSING TECHNOLOGIES (AMPT2010)
24–27 October 2010
Paris, (France)
Research Article|
January 17 2011
Finite Element Modeling of a Non‐Isothermal Superplastic‐Like Forming Process Available to Purchase
Jun Liu;
Jun Liu
aSch. of Mechanical & Aerospace Engineering, Nanyang Technological University, 639798, Singapore
Search for other works by this author on:
Ming‐Jen Tan;
Ming‐Jen Tan
aSch. of Mechanical & Aerospace Engineering, Nanyang Technological University, 639798, Singapore
Search for other works by this author on:
Sylvie Castagne;
Sylvie Castagne
aSch. of Mechanical & Aerospace Engineering, Nanyang Technological University, 639798, Singapore
Search for other works by this author on:
Anders E. W. Jarfors;
Anders E. W. Jarfors
bSingapore Institute of Manufacturing Technology, 638075, Singapore
Search for other works by this author on:
Kai‐Soon Fong;
Kai‐Soon Fong
bSingapore Institute of Manufacturing Technology, 638075, Singapore
Search for other works by this author on:
Emin Bayraktar
Emin Bayraktar
cSupmeca‐Paris, Mechanical Engineering School, France
Search for other works by this author on:
Jun Liu
a
Ming‐Jen Tan
a
Sylvie Castagne
a
Yingyot Aue‐u‐lan
Anders E. W. Jarfors
b
Kai‐Soon Fong
b
Emin Bayraktar
c
aSch. of Mechanical & Aerospace Engineering, Nanyang Technological University, 639798, Singapore
bSingapore Institute of Manufacturing Technology, 638075, Singapore
cSupmeca‐Paris, Mechanical Engineering School, France
AIP Conf. Proc. 1315, 377–382 (2011)
Citation
Jun Liu, Ming‐Jen Tan, Sylvie Castagne, Yingyot Aue‐u‐lan, Anders E. W. Jarfors, Kai‐Soon Fong, Emin Bayraktar; Finite Element Modeling of a Non‐Isothermal Superplastic‐Like Forming Process. AIP Conf. Proc. 17 January 2011; 1315 (1): 377–382. https://doi.org/10.1063/1.3552472
Download citation file:
Pay-Per-View Access
$40.00
Sign In
You could not be signed in. Please check your credentials and make sure you have an active account and try again.
Citing articles via
Effect of coupling agent type on the self-cleaning and anti-reflective behaviour of advance nanocoating for PV panels application
Taha Tareq Mohammed, Hadia Kadhim Judran, et al.
Design of a 100 MW solar power plant on wetland in Bangladesh
Apu Kowsar, Sumon Chandra Debnath, et al.
With synthetic data towards part recognition generalized beyond the training instances
Paul Koch, Marian Schlüter, et al.
Related Content
A Constant Stress Creep Apparatus for Superplastic Metals
Rev. Sci. Instrum. (September 1969)
Modelling of Superplastic Forming of AZ31 Magnesium Alloy
AIP Conf. Proc. (January 2011)
Numerical/experimental investigation of the production of thin magnesium alloy components via superplastic forming
AIP Conf. Proc. (July 2019)