This paper focuses both analytical and numerical approaches to identified disbonds in FMLs layers using step pulsed active thermography (SPAT). The analytical results are compared with results obtained from numerical modeling using finite element method (FEM). The numerical results reveal that the disbonds are identified more quickly with increased thermal contrast (ΔT), when heat flux (q) increases. By further observation, it could be concluded that the FEM is an efficient tool to obtain numerical results due to easy and reduced time‐consumption with increased accuracy thereby developing a detailed procedure to estimate the heat flux for future cases related to disbonds in FMLs. The comparative study indicates that the variation between analytical and numerical results is closer.
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26 October 2010
INTERNATIONAL CONFERENCE ON MODELING, OPTIMIZATION, AND COMPUTING (ICMOS 20110)
28–30 October 2010
West Bengal, (India)
Research Article|
October 26 2010
Estimation of Required Heat Input for the Evaluation of Disbonds in FML Using Thermography
S. Sundaravalli;
S. Sundaravalli
aInternational College of Engineering and Management, P.O. Box: 2511, PC‐111, Sultanate of Oman
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G. K. Vijayaraghavan;
G. K. Vijayaraghavan
bCaledonian College of Engineering, P.O. Box: 2322, PC‐111, Sultanate of Oman
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M. C. Majumder
M. C. Majumder
cNational Institute of Technology, Durgapur, India 713 209
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AIP Conf. Proc. 1298, 129–134 (2010)
Citation
S. Sundaravalli, G. K. Vijayaraghavan, M. C. Majumder; Estimation of Required Heat Input for the Evaluation of Disbonds in FML Using Thermography. AIP Conf. Proc. 26 October 2010; 1298 (1): 129–134. https://doi.org/10.1063/1.3516288
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