Some Issues in Micromechanical Modeling for Granular Assembly

The approach of micromechanical modeling has been used in developing stress‐strain models for granular materials. This approach takes into account of the behavior at grain level and predicts the stress‐strain behavior of the granular assembly. Although the developed stress‐strain models may be in different form, the issues encountered during the process of modeling are expected to be similar. Most issues are connected to two general questions: (1) How to reduce the errors caused by macro‐to‐micro hypotheses and other simplified assumptions? and (2) For the local behavior at the grain level, how to include the correct physics to establish a suitable yet simple inter‐particle model? These issues will be discussed and suitability of the approach will be evaluated in the presentation.