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Journal Articles

Electrochemical method for treatment of metals extraction waste

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Marinela Panayotova, Vladko Panayotov
Journal: AIP Conference Proceedings
AIP Conf. Proc. 2847, 040008 (2023)
https://doi.org/10.1063/5.0165373
Published: November 2023
View articletitled, Electrochemical method for treatment of metals extraction waste
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Journal Articles

Modeling electromigration of chlorides and nanoparticles in concrete

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Jiří Němeček, Jaroslav Kruis, Tomáš Koudelka, Jitka Němečková
Journal: AIP Conference Proceedings
AIP Conf. Proc. 2849, 170009 (2023)
https://doi.org/10.1063/5.0162240
Published: September 2023
View articletitled, Modeling electromigration of chlorides and nanoparticles in concrete
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Journal Articles

Effect of internal concrete corrosion on reinforced-concrete sleepers

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Andrii Plugin, Olga Borziak, Sergii Miroshnichenko, Oksana Krykun, Vladyslava Zinchenko
Journal: AIP Conference Proceedings
AIP Conf. Proc. 2557, 070004 (2022)
https://doi.org/10.1063/5.0104860
Published: October 2022
View articletitled, Effect of internal concrete corrosion on reinforced-concrete sleepers
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Journal Articles

Electromigration and stress affected kinetics of IMC growth of binary Cu-Sn couple

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Vladislav Shtegman, Aleksandr Morozov, Alexander Freidin, Wolfgang H. Müller
Journal: AIP Conference Proceedings
AIP Conf. Proc. 2371, 030007 (2021)
https://doi.org/10.1063/5.0059609
Published: July 2021
View articletitled, Electromigration and stress affected kinetics of IMC growth of binary Cu-Sn couple
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Journal Articles

Effect of thermal aging on electromigration failure of a flip-chip SnAgCu solder joint subjected to random vibration

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Mohammad Abdul Motalab, Md. Tusher Ahmed, Md. Omarsany Bappy
Journal: AIP Conference Proceedings
AIP Conf. Proc. 2324, 030015 (2021)
https://doi.org/10.1063/5.0039955
Published: February 2021
View articletitled, Effect of thermal aging on electromigration failure of a flip-chip SnAgCu solder joint subjected to random vibration
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Journal Articles

Electroionite processes modeling of isotopes separation

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Anatoly Vergun, Ludmila Dorofeeva, Dmitry Belyakov
Journal: AIP Conference Proceedings
AIP Conf. Proc. 2101, 020015 (2019)
https://doi.org/10.1063/1.5099607
Published: April 2019
View articletitled, Electroionite processes modeling of isotopes separation
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Journal Articles

Al-based front contacts for HCPV solar cell

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Pengyun Huo, Ignacio Rey-Stolle
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1881, 040004 (2017)
https://doi.org/10.1063/1.5001426
Published: September 2017
View articletitled, Al-based front contacts for HCPV solar cell
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Journal Articles

Remediation of lead (Pb) and copper (Cu) using water hyacinth [Eichornia crassipes (Mart.) Solms] with electro-assisted phytoremediation (EAPR)

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Rudy Syah Putra, Desi Novarita, Fachri Cahyana
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1744, 020052 (2016)
https://doi.org/10.1063/1.4953526
Published: June 2016
View articletitled, Remediation of lead (Pb) and copper (Cu) using water hyacinth [Eichornia crassipes (Mart.) Solms] with electro-assisted phytoremediation (EAPR)
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Journal Articles

Microstructure, impurity and metal cap effects on Cu electromigration

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C.-K. Hu, L. G. Gignac, J. Ohm, C. M. Breslin, E. Huang, G. Bonilla, E. Liniger, R. Rosenberg, S. Choi, A. H. Simon
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1601, 67–78 (2014)
https://doi.org/10.1063/1.4881341
Published: June 2014
View articletitled, Microstructure, impurity and metal cap effects on Cu electromigration
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Journal Articles

Physics-based simulation of EM and SM in TSV-based 3D IC structures

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Armen Kteyan, Valeriy Sukharev, Ehrenfried Zschech
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1601, 114–127 (2014)
https://doi.org/10.1063/1.4881345
Published: June 2014
View articletitled, Physics-based simulation of EM and SM in TSV-based 3D IC structures
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Journal Articles

Electromigration void nucleation and growth analysis using large-scale early failure statistics

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M. Hauschildt, M. Gall, C. Hennesthal, G. Talut, O. Aubel, K. B. Yeap, E. Zschech
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1601, 89–98 (2014)
https://doi.org/10.1063/1.4881343
Published: June 2014
View articletitled, Electromigration void nucleation and growth analysis using large-scale early failure statistics
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Journal Articles

Modeling of microstructural effects on electromigration failure

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H. Ceric, R. L. de Orio, W. Zisser, S. Selberherr
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1601, 99–113 (2014)
https://doi.org/10.1063/1.4881344
Published: June 2014
View articletitled, Modeling of microstructural effects on electromigration failure
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Journal Articles

Assessment of fracture and elastoplastic properties of thin and very thin films

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M. Trueba, D. Gonzalez, I. Ocaña, M. R. Elizalde, J. M. Martinez-Esnaola, M. T. Hernandez, M. Haverty, G. Xu, D. Pantuso
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1601, 158–167 (2014)
https://doi.org/10.1063/1.4881349
Published: June 2014
View articletitled, Assessment of fracture and elastoplastic properties of thin and very thin films
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Journal Articles

Multi-scale simulation flow and multi-scale materials characterization for stress management in 3D through-silicon-via integration technologies – Effect of stress on 3D IC interconnect reliability

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Valeriy Sukharev, Ehrenfried Zschech
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1601, 18–54 (2014)
https://doi.org/10.1063/1.4881339
Published: June 2014
View articletitled, Multi-scale simulation flow and multi-scale materials characterization for stress management in 3D through-silicon-via integration technologies – Effect of stress on 3D IC interconnect reliability
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Journal Articles

Reliability Testing of Advanced Interconnect Materials

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R. R. Keller, M. C. Strus, A. N. Chiaramonti, Y. L. Kim, Y. J. Jung, D. T. Read
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1395, 259–263 (2011)
https://doi.org/10.1063/1.3657900
Published: November 2011
View articletitled, Reliability Testing of Advanced Interconnect Materials
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Journal Articles

Grain Size And Cap Layer Effects On Electromigration Reliability Of Cu Interconnects: Experiments And Simulation

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Lijuan Zhang, Matthias Kraatz, Oliver Aubel, Christian Hennesthal, Ehrenfried Zschech, Paul S. Ho
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1300, 3–11 (2010)
https://doi.org/10.1063/1.3527136
Published: November 2010
View articletitled, Grain Size And Cap Layer Effects On Electromigration Reliability Of Cu Interconnects: Experiments And Simulation
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Journal Articles

Influence Of The Activation Energy Of The Different Migration Effects On Failure Locations In Metallization

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Kirsten Weide‐Zaage, Joharsyah Ciptokusumo, Oliver Aubel
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1300, 85–90 (2010)
https://doi.org/10.1063/1.3527141
Published: November 2010
View articletitled, Influence Of The Activation Energy Of The Different Migration Effects On Failure Locations In Metallization
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Journal Articles

Conical Dark‐Field Analysis For Small Grain Characterization In Narrow Cu Interconnect Structures: Potential And Challenges

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René Hübner, Hans‐Jürgen Engelmann, Ehrenfried Zschech
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1300, 39–46 (2010)
https://doi.org/10.1063/1.3527135
Published: November 2010
View articletitled, Conical Dark‐Field Analysis For Small Grain Characterization In Narrow Cu Interconnect Structures: Potential And Challenges
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Journal Articles

Stress Phenomena In Times Of Porous Low‐k Dielectrics

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O. Aubel, M. Grillberger, J. Poppe, M. Lehr, C. Hennesthal
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1300, 68–77 (2010)
https://doi.org/10.1063/1.3527139
Published: November 2010
View articletitled, Stress Phenomena In Times Of Porous Low‐k Dielectrics
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Journal Articles

Effect Of Microstructure On Electromigration In Pb‐free Solder Interconnect

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Minhua Lu
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1300, 229–237 (2010)
https://doi.org/10.1063/1.3527130
Published: November 2010
View articletitled, Effect Of Microstructure On Electromigration In Pb‐free Solder Interconnect
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