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Thermal study of LED chip arrangement on MCPCB

AIP Conf. Proc. 1885, 020254 (2017)
This article has been cited by the following articles in journals that are participating in CrossRef Cited-by Linking.
  • M. Hamidnia
  • Y. Luo
  • X.D. Wang
Applied Thermal Engineering (2018) 145: 637.
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